SensL’s custom range of J-Series TSV sensors have been used to create high fill-factor, scaleable arrays. The TSV sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3mm, 4mm or 6mm pixels.
The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well. Each array has an associated breakout board (BOB) or evaluation board that allows for easy access to the pixel signals and performance evaluation of the arrays.
|Arrays of J-Series TSV SiPM pixels||J-Series TSV sensors are reflow soldered onto PCB to create arrays with >90% fill factor
|Variety of formats and pixel sizes available||Featuring pixel sizes of either 3mm, 4mm or 6mm in various array configurations from 2 x 2 to 8 x 8
|Optional evaluation boards for easy access to signals||Either the BOB or evaluation PCB products