Both C-Series and J-Series SiPMs are blue sensitive sensors that have peak response at 420 nm.
C-Series sensors are available as 1 mm, 3 mm or 6 mm sensors, whereas the J-Series sensors are available in 3 mm, 4 mm and 6 mm sizes. They also differ in terms of package type and performance
C-Series products are assembled using a wire bond leadframe process encapsulated in a clear transfer molded package. The resulting MLP package is reliable, robust and suitable for SMT assembly in a wide variety of applications.
The C-Series sensors have the lowest noise.
J-Series products are created a Through Silicon Via (TSV) process where the terminal connections are made using a via through the silicon die to the solder balls on the back of the board. The package has a glass cover on top of the sensor. The TSV package has minimal dead space around the active area of the sensor and so can achieve a higher fill factor when the sensors are formed into arrays.
The glass entrance window of the J-Series TSV package has better transmission of UV light and so J-Series sensors have sensitivity down to 200 nm, whereas the C-Series sensitivity cuts off around 300 nm.
J-Series products have higher microcell fill factor that results in a higher PDE and have optimised signal tracking layout for better timing performance.