ArrayJ 2017-05-02T08:21:41+00:00

ArrayJ

High Fill-Factor Arrays for Fast Timing Applications

SensL’s custom range of J-Series TSV sensors have been used to create high fill-factor, scaleable arrays. The TSV sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3mm or 6mm pixels.

The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well. Each array has an associated breakout board (BOB) or evaluation board (EVB) that allows for easy access to the pixel signals and performance evaluation of the arrays.

Key Features

J-Series TSV sensors are reflow soldered onto PCB to create arrays with >90% fill factor
Featuring pixel sizes of either 3mm or 6mm in various array configurations
  • Available with pixel sizes of either 3mm or 6mm
  • Variety of formats ranging from 2×2 to 8×8
  • Minimal deadspace, with fill factors of >90%
  • Each array as either a multi-way connector or BGA on the reverse for access to all signals
  • Evaluation boards available for easy access to signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual J-Series sensors

SiPM Array Images

Specification Summary

Please refer to the ArrayJ product brief for a complete list of features and technical details, and the J-Series datasheet for the performance of the individual pixels.

Pixel sizeArray configurationBreakout Boards available
6mm2x2Standard
6mm8x8Standard & summed
3mm4x4Standard
3mm8x8Standard

ArrayJ eStore

Welcome to the SensL eStore.  Here you can quickly purchase sample quantities of all SiPM sensors including the ArrayJ products.  If you require a formal quote or have a high volume requirement please email our sales team.

Please visit the main eStore for all of our products.

Part Number Ordering Information

Part NumberItem DescriptionSilicon SeriesSensor Size in mm (XX)Cell Size (YYY)Package Type
ArrayJ-30035-16P-PCB4x4 Array of MicroFJ-30035-TSV on PCB with INDIVIDUAL pixel fast and standard readout. Connector Style I/OJ335PCB
ArrayJ-30035-64P-PCB8x8 Array of MicroFJ-30035-TSV on PCB with INDIVIDUAL fast and standard readout. Connector Style I/OJ335PCB
ArrayJ-60035-4P-BGA2x2 Array of MicroFJ-60035-TSV on PCB with INDIVIDUAL pixel fast and standard readout. BGA Style I/OJ635PCB
ArrayJ-60035-4P-EVBPixelated SMA Evaluation BoB with a permanently attached ArrayJ-60035-4PJ635PCB
ArrayJ-60035-64P-PCB8x8 Array of MicroFJ-60035-TSV on PCB with INDIVIDUAL pixel fast and standard readout. Connector Style I/OJ635PCB
ArrayJ-BOB3-16PPixelated Break out board for evaluating the 4x4 3mm TSV (No active electronics; 3 SMA connectors)JPCB
ArrayJ-BOB3-64PPixelated Break out board for evaluating the 8x8 3mm TSV Arrays (No active electronics; 3 SMA connectors)JPCB
ArrayX-BOB6-64PPixelated Break out board for evaluating the 8x8 6mm SMT and TSV Arrays (No active electronics; 3 SMA connectors)C,JPCB
ArrayX-BOB6-64SSummed Break out board for evaluating the 8x8 6mm SMT/MLP and TSV Arrays (No active electronics; 3 SMA connectors)C,JPCB