SensL’s custom range of J-Series TSV sensors have been used to create high fill-factor, scaleable arrays. The TSV sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3mm or 6mm pixels.
The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well. Each array has an associated breakout board (BOB) or evaluation board (EVB) that allows for easy access to the pixel signals and performance evaluation of the arrays.