SiPM Arrays

SensL has a number of array products, formed of individual SiPM sensors mounted onto PCB with minimal deadspace.

These products are designed to give customers a tool to rapidly test arrays in standard configurations.  Most come with connectors for simple connection to customer readout electronics daughter boards.  Once tested customers may choose to design arrays using discreet SiPM devices or continue to use SensL arrays in their final system.

ArrayC

Arrays of C-Series SMT sensors, with high PDE and lowest noise

SensL’s custom range of SMT (surface mount technology) SiPM sensors have been used to create compact and scaleable arrays  that are available in a variety of formats and formed of pixels of different size.

The back of each ArrayC has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well. Each array has an associated breakout board (BOB) or evaluation board (EVB) that allows for easy access to the pixel signals and performance evaluation of the arrays.

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ArrayJ

Arrays of J-Series TSV sensors for high performance timing applications

SensL’s custom range of J-Series TSV sensors have been used to create high fill-factor, scaleable arrays. The TSV sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3mm or 6mm pixels.

The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well. Each array has an associated breakout board (BOB) or evaluation board (EVB) that allows for easy access to the pixel signals and performance evaluation of the arrays.

More info