SPMMicro Technical Guide

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Configurations of the SPMMicro

The SPMMicro series detectors come in a variety of pin package formats according to footprint requirements, levels of hermeticity, and cooling. These include glass/metal sealed transistor header package types such as TO46/TO18, TO5 and TO8 as well as ceramic packages which are TO5 pin compatible. In our ceramic packages the detector is mounted on a ceramic header and covered with a clear epoxy resin. This is ideal for applications that require excellent coupling to scintillators.

All glass⁄metal sealed transistor headers (TO can packages) are built to the highest hermeticity specification and are capable of passing fine and gross leak testing per MIL standard MIL-STD-750, Method 1071(<1x10-8 atm cc/sec Helium gas for fine leak tests). Ongoing tests have shown that SPMMicro detector (TO8 assembly) parameters have not degraded after 7,000 hours of continuous bias operation

The following table lists the package types which are available for each detector type to address different performance specifications and environmental operations.

Detector Package Type SPM Detector Choice Comments
TO8 Can Package
(x08 package)		 SPM1020, SPM1035, SPM1050
SPM3020, SPM3035,		 Hermetic Can: 6 pin header, suitable for use with 2-stage TEC allowing cooling to -20C. Accommodates 1mm and 3mm detectors.
TO5 Can Package
(x05 package)		 SPM3020, SPM3035, Hermetic Can: 3 pin header metal package available with 3mm detectors)
T018 Package
(x18 package)		 SPM1020, SPM1035, SPM1050, SPM1100 Hermetic Can: 3 pin header metal package available with 1mm detectors)
Ceramic Package Discretes
(x13 package)		 SPM1020, SPM1035, SPM1050, SPM1100
SPM3020, SPM3035, SPM3050		 Ceramic Submount: 2 pin ceramic package (TO5 pin compatible) available with 1mm and 3mm detector)
Ceramic Package 2x2 Large area detector
(x13 package)		 SPM6035
SPM6050		 Ceramic Submount: 2 pin TO5 pin compatible package, available with 3mm detectors mounted in 2x2 configuration. The die butted into the package together into a ceramic package and orientated for parallel connections between pixels.