Wafer processing is carried out in a Tier-1 CMOS foundry using standard 8-inch CMOS processes. Sensors are electrically and optically tested at wafer probe, where 1,000,000 product tests are carried out per wafer lot.
A high-volume packaging process using Tier-1 packaging contract manufacturers is used. This incorporates 100% end-of-line product test that includes electrical test, illuminated and dark current measurement and automatic visual inspection. Tested sensors are shipped to customers on cut tape or tape and reel and meet the exact specifications of the datasheet. No individual lot or device test sheets are necessary.